Pixel structure and manufacturing method thereof

ABSTRACT

A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of and claims priority benefit of U.S.patent application Ser. No. 13/094,841, filed on Apr. 27, 2011, now U.S.Pat. No. 8,530,912, which claims the priority benefit of Taiwanapplication serial no. 99120280, filed Jun. 22, 2010. The entirety ofeach of the above-mentioned patent applications is hereby incorporatedby reference herein and made a part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a structure and amanufacturing method thereof, and more particularly, to a pixelstructure and a manufacturing method thereof.

2. Description of Related Art

The sizes of video or image devices have been reduced along with theimprovement in computer performance and the development of the Internetand multimedia technologies. Regarding the development of displays,liquid crystal display (LCD) has become the mainstream product intoday's display market along with the advancement of photovoltaic andsemiconductor manufacturing techniques thanks to its many advantages,such as high image quality, high space efficiency, low powerconsumption, and no radiation.

In recent years, an “array on color filter (AOC)” and a LCD panel withtwo opposite substrates and a common electrode have been provided alongwith the development of display panels. Generally speaking, an AOCsubstrate includes a color filter layer and a conventional active devicearray layer, wherein the active device array layer is usually disposedabove the color filter layer.

However, a storage capacitor is usually formed on an AOC substrate byusing the pixel electrode and a common electrode. Since the commonelectrode takes up space within the pixel region, the aperture ratiocannot be effectively improved when the AOC substrate is applied to adisplay panel.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a pixel structure withan improved aperture ratio.

The present invention is also directed to a method for manufacturingaforementioned pixel structure.

The present invention provides a pixel structure including a substrate,a color filter layer, a conductive light-shielding layer, a bufferlayer, a scan line, a data line, an active device, and a pixelelectrode. The substrate has a pixel region. The color filter layer isdisposed corresponding to the pixel region of the substrate. Theconductive light-shielding layer is disposed corresponding to theperiphery of the pixel region. The buffer layer covers the conductivelight-shielding layer and the color filter layer. The scan line and thedata line are disposed above the buffer layer. The active device isdisposed above the buffer layer and electrically connected to the scanline and the data line. The pixel electrode is disposed above the bufferlayer and electrically connected to the active device, wherein anoverlapping area between the pixel electrode and the conductivelight-shielding layer constitutes a storage capacitor.

The present invention provides a pixel structure including a substrate,a color filter layer, a scan line, a data line, an active device, apixel electrode, a buffer layer, and a conductive light-shielding layer.The substrate has a pixel region. The color filter layer is disposedabove the substrate and corresponding to the pixel region. The scan lineand the data line are disposed above the color filter layer. The activedevice is disposed above the color filter layer and electricallyconnected to the scan line and the data line. The pixel electrode isdisposed above the color filter layer and electrically connected to theactive device. The buffer layer covers the pixel electrode. Theconductive light-shielding layer is disposed above the buffer layer andcorresponding to the periphery of the pixel region. An overlapping areabetween the pixel electrode and the conductive light-shielding layerconstitutes a storage capacitor.

The present invention provides a method for manufacturing a pixel array.The method includes following steps. First, a substrate having aplurality of pixel regions is provided. Then, a color filter layercorresponding to the pixel regions is formed above the substrate. Next,a conductive light-shielding layer is formed at the peripheries of thepixel regions. After that, a buffer layer is formed above the substrateto cover the conductive light-shielding layer and the color filterlayer. Next, a plurality of scan lines, a plurality of data lines, and aplurality of active devices electrically connected to the scan lines andthe data lines are formed above the buffer layer. After that, aplurality of pixel electrodes is formed above the buffer layer, whereineach of the pixel electrodes is electrically connected to one of theactive devices, and an overlapping area between each of the pixelelectrodes and the conductive light-shielding layer constitutes astorage capacitor.

The present invention provides a method for manufacturing a pixel array.The method includes following steps. First, a substrate having aplurality of pixel regions is provided. Then, a color filter layercorresponding to the pixel regions is formed above the substrate. Next,a plurality of scan lines, a plurality of data lines, and a plurality ofactive devices electrically connected to the scan lines and the datalines are formed above the color filter layer. Next, a plurality ofpixel electrodes is formed above the color filter layer, wherein each ofthe pixel electrodes is electrically connected to one of the activedevices. After that, a buffer layer is formed to cover the activedevices and the pixel electrodes. Next, a conductive light-shieldinglayer is formed at the peripheries of the pixel regions above the bufferlayer, wherein an overlapping area between each of the pixel electrodesand the conductive light-shielding layer constitutes a storagecapacitor.

The present invention provides a pixel structure including a substrate,a color filter layer, a scan line, a data line, an active device, abuffer layer, a conductive light-shielding layer, a planarization layer,and a pixel electrode. The substrate has a pixel region. The colorfilter layer is disposed above the substrate and corresponding to thepixel region. The scan line and the data line are disposed above thecolor filter layer. The active device is disposed above the color filterlayer and electrically connected to the scan line and the data line. Thebuffer layer covers the active device. The conductive light-shieldinglayer is disposed above the buffer layer and corresponding to theperiphery of the pixel region. The planarization layer covers theconductive light-shielding layer. The pixel electrode is disposed abovethe planarization layer and above the color filter layer, and the pixelelectrode is electrically connected to the active device. An overlappingarea between the pixel electrode and the conductive light-shieldinglayer constitutes a storage capacitor.

The present invention provides a method for manufacturing a pixel array.The method includes following steps. First, a substrate having aplurality of pixel regions is provided. Then, a color filter layercorresponding to the pixel regions is formed above the substrate. Next,a plurality of scan lines, a plurality of data lines, and a plurality ofactive devices electrically connected to the scan lines and the datalines are formed above the color filter layer. After that, a bufferlayer is formed to cover the active devices. Next, a conductivelight-shielding layer is formed at the peripheries of the pixel regionsabove the buffer layer. Thereafter, a planarization layer is formed tocover the conductive light-shielding layer. Then, a plurality of pixelelectrodes is formed above the planarization layer and also above thecolor filter layer, wherein each of the pixel electrodes is electricallyconnected to one of the active devices, and an overlapping area betweeneach of the pixel electrodes and the conductive light-shielding layerconstitutes a storage capacitor.

As described above, in a pixel structure provided by the presentinvention, a conductive light-shielding layer is disposed at theperiphery of a pixel region, and an overlapping area between a pixelelectrode and the conductive light-shielding layer constitutes a storagecapacitor of the pixel structure. Namely, besides being served as ablack matrix as in the conventional display technique, the conductivelight-shielding layer is also served as a storage capacitor by partiallyoverlapping it with the pixel electrode. Thus, the aperture ratio of thepixel structure is improved by replacing the conventional design havinga common electrode as a storage capacitor. The present invention alsoprovides a method for manufacturing foregoing pixel structure and pixelarray.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is a partial top view of a pixel structure in a pixel arrayaccording to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the pixel structure in FIG. 1 alongline AA′.

FIGS. 3A-3G are cross-sectional views illustrating how the pixelstructure in FIG. 1 is manufactured along line the AA′.

FIG. 3H is a diagram illustrating a shadow mask manufacturing processaccording to an embodiment.

FIG. 4A and FIG. 4B are cross-sectional views respectively illustratingother possible optical structures adopted by the pixel structure in FIG.2.

FIG. 5 is a cross-sectional view of another pixel structure along theline AA′ in FIG. 1.

FIGS. 6A-6E are cross-sectional views illustrating a manufacturingprocess of the pixel structure in FIG. 5.

FIG. 7 is a cross-sectional view of a pixel structure according toanother embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numbers areused in the drawings and the description to refer to the same or likeparts.

FIG. 1 is a partial top view of a pixel structure in a pixel arrayaccording to an embodiment of the present invention, and FIG. 2 is across-sectional view of the pixel structure in FIG. 1 along line AA′.Referring to both FIG. 1 and FIG. 2, in the present embodiment, thepixel structure 100 includes a substrate 110, a color filter layer 120,a conductive light-shielding layer 130, a buffer layer 140, a scan line150, a data line 160, an active device 170, and a pixel electrode 180.The substrate 110 has a pixel region 112, and the color filter layer 120is corresponding to the pixel region 112 of the substrate 110. In thepresent embodiment, the substrate 110 may be a glass substrate or othertypes of transmissive substrates. Besides, the color filter layer 120 inthe present embodiment may be formed by arranging red filter layers,green filter layers, and blue filter layers alternatively or as an arrayaccording to the actual design requirement. In addition, the color ofthe color filter layer 120 is not limited to red, green, or blue, andwhich may also be a color obtained by mixing foregoing three colors.

The conductive light-shielding layer 130 is corresponding to theperiphery of the pixel region 112 of the substrate 110, as shown in FIG.1 and FIG. 2. However, the structure of the conductive light-shieldinglayer 130 is not limited to the mesh black matrix but may also be a gridor other structures according to the actual design requirement. In thepresent embodiment, the relative position between the conductivelight-shielding layer 130 and the pixel region 112 may be the same asthe typical relative position between a black matrix and a color filterlayer. For example, assuming that the color filter layer 120 of acorresponding pixel array is arranged as a red filter layer, a greenfilter layer, and a blue filter layer, the conductive light-shieldinglayer may be disposed between these color filter layers so that theoverall arrangement may be the red filter layer, the conductivelight-shielding layer, the green filter layer, the conductivelight-shielding layer, and the blue filter layer from left to right. Inother words, herein the periphery refers to that the conductivelight-shielding layer 130 surrounds each color filter layer 120, asshown in FIG. 1. However, the present invention is not limited thereto.

In the present embodiment, the pixel structure 100 may further include aplanarization layer 192 disposed between the color filter layer 120 andthe conductive light-shielding layer 130, as shown in FIG. 2. Theplanarization layer 192 may be made of an insulating material, adielectric material, an organic material, or an inorganic material.Besides maintaining a flat surface, the planarization layer 192 alsoprevents the conductive light-shielding layer 130 and the color filterlayer 120 from contaminating each other. Additionally, in the presentembodiment, the color filter layer 120 is disposed on the substrate 110,and the conductive light-shielding layer 130 is disposed above the colorfilter layer 120, as shown in FIG. 2.

Referring to FIG. 1 and FIG. 2 again, the buffer layer 140 covers theconductive light-shielding layer 130 and the color filter layer 120.Herein the term “cover” refers to that one is directly on or above theother. For example, the buffer layer 140 covering the color filter layer120 means that the buffer layer 140 is on the color filter layer 120.The term “cover” will have the same meaning thereinafter. In the presentembodiment, the buffer layer 140 may be made of an insulating material,a dielectric material, an organic material, or an inorganic material(for example, silicon oxide or silicon nitride) such that whensubsequently an electronic device is formed on the substrate, noelectrical connection (accordingly short circuit) is established betweenthe electronic device and the conductive light-shielding layer. Besides,the scan line 150, the data line 160, and the active device 170 aredisposed on the buffer layer 140, and the active device 170 iselectrically connected to the scan line 150 and the data line 160, asshown in FIG. 1 and FIG. 2. In the present embodiment, the active device170 may be a thin film transistor (TFT), and which includes a source172, a gate 174, and a drain 176. The source 172 is electricallyconnected to the data line 160, and the gate 174 is electricallyconnected to the scan line 150. Additionally, in the present embodiment,the active device 170 and the conductive light-shielding layer 130 atleast partially overlap each other, as shown in FIG. 1 and FIG. 2.

The pixel electrode 180 is disposed above the buffer layer 140 andelectrically connected to the active device 170. An overlapping area P1between the pixel electrode 180 and the conductive light-shielding layer130 constitutes a storage capacitor C1, as shown in FIG. 1 and FIG. 2.In the present embodiment, the pixel structure 100 further includes apassivation layer 194. The passivation layer 194 covers the activedevice 170 and the buffer layer 140, as shown in FIG. 2. To be specific,the passivation layer 194 and the buffer layer 140 between the pixelelectrode 180 and the conductive light-shielding layer 130 are served asa capacitor dielectric layer of the storage capacitor C1. Accordingly,the pixel structure 100 can have a greater storage capacitance accordingto the size of the overlapped area between the conductivelight-shielding layer 130 and the pixel electrode 180. Namely, besidesbeing served as a black matrix, the conductive light-shielding layer 130in the present embodiment is also served as a storage capacitor of thepixel structure 100 because of the conductivity thereof and theoverlapping area between the conductive light-shielding layer 130 andthe pixel electrode 180. Thereby, the common electrode served as astorage capacitor in the conventional technique can be omitted, and theaperture ratio of the pixel structure 100 in the present embodiment isimproved.

In the present embodiment, the pixel electrode 180 may be made of atransmissive conductive material, and the active device 170 determineswhether an electronic signal on the data line 160 can sequentially passthrough the source 172 and the drain 176 to reach the pixel electrode180 and charge the storage capacitor C1 by controlling the voltagesupplied to the gate 174. Herein the operations of the active device 170and the pixel electrode 180 are well known to those having ordinaryknowledge in the art therefore will not be described herein.

As described above, in the pixel structure 100 provided by the presentembodiment, the conductive light-shielding layer 130 is disposed at theperiphery of the pixel region 112, and an overlapping area P1 betweenthe pixel electrode 180 and the conductive light-shielding layer 130constitutes the storage capacitor C1 of the pixel structure 100.Accordingly, besides being served as a black matrix as in theconventional display technique, the conductive light-shielding layer 130is also served as a storage capacitor when it is partially overlappedwith the pixel electrode 180. Thus, the conventional design having acommon electrode as the storage capacitor is replaced, and the apertureratio of the pixel structure 100 in the present embodiment is improved.Or, the pixel structure 100 may keep the conventional design with thecommon electrode together with the storage capacitor C1 formed by theconductive light-shielding layer 130 and the pixel electrode 180 in thepresent embodiment. In this case, the pixel structure 100 in the presentembodiment can have a greater storage capacitance, and accordingly abetter electrical performance, compared to a conventional pixelstructure.

FIGS. 3A-3G are cross-sectional views illustrating how the pixelstructure in FIG. 1 is manufactured along line the AA′. Referring toFIG. 3A, first, the substrate 110 is provided. The substrate 110 has aplurality of pixel regions 112. The material of the substrate 110 can bereferred to foregoing description.

Then, the color filter layer 120 is formed on the substrate 110, whereinthe color filter layer 120 is corresponding to the pixel regions 112, asshown in FIG. 3B. In the present embodiment, the color arrangement ofthe color filter layer 120 can be referred to foregoing descriptiontherefore will not be described herein. In addition, the color filterlayer 120 may be formed by sequentially or simultaneously sprayingdifferent colors (for example, red, green, and blue, etc) of dyes intothe corresponding pixel regions 112 with an inkjet nozzle or by definingdifferent colors (for example, red, green, and blue, etc) of colorresistors through a lithography process. Besides, after forming thecolor filter layer 112, the dyes are sequentially or simultaneouslysolidified to allow the solvent in the color filter layer 112 toevaporate. It should be noted that the technique for forming the colorfilter layer 120 described above is only an example but not intended tolimit the present invention.

Next, the planarization layer 192 is selectively formed on the colorfilter layer 120 to cover the color filter layer 120, as shown in FIG.3B. In another embodiment, subsequent steps illustrated in FIG. 3C maybe directly executed without forming the planarization layer 192 on thecolor filter layer 120. However, the procedure described in presentembodiment is only an example and is not limited to that illustrated inthe drawings.

Thereafter, the conductive light-shielding layer 130 is formed at theperipheries of the pixel regions 112 on the substrate 110, as shown inFIG. 3C. In the present embodiment, the conductive light-shielding layer130 may be made of a black or dark conductive material, such as a metal.However, the present invention is not limited thereto, and theconductive light-shielding layer 130 may be made of any conductive andlight-shielding material. The conductive light-shielding layer 130 maybe formed through different technique based on the material thereof. Forexample, the conductive light-shielding layer 130 may be formed throughsputtering, evaporation, or another suitable deposition technique if itis made of a conductive light-shielding metal.

Next, the buffer layer 140 is formed on the substrate 110 to cover theconductive light-shielding layer 130 and the color filter layer 120, asshown in FIG. 3D. In the present embodiment, the material of the bufferlayer 140 may be referred to foregoing description, and the buffer layer140 may be formed through chemical vapour deposition (CVD) or anothersuitable technique, such as screen printing, coating, inkjet printing,or energy source processing.

Thereafter, a plurality of scan lines 150, a plurality of data lines160, and a plurality of active devices 170 electrically connected to thescan lines 150 and the data lines 160 are formed on the buffer layer140, as shown in FIG. 3E. In the present embodiment, each of the activedevices 170 further has a gate dielectric layer 178 besidesaforementioned source 172, gate 174, and drain 176. Besides, becauseonly one pixel structure 100 is illustrated in FIG. 3E, only one scanline 150, one data line 160, and one active device 170 can be observed.The pixel array is composed of a plurality of pixel structures 100 thatare arranged as an array, wherein how the pixel structures are arrangedin the pixel array is well known to those having ordinary knowledge inthe art therefore will not be described herein. In addition, in thepresent embodiment, the active devices 170 are assumed to be top-gateTFTs. The technique for forming the top-gate TFTs is also well known tothose having ordinary knowledge in the art therefore will not bedescribed herein.

Next, the passivation layer 194 is selectively formed on the bufferlayer 140 to cover the active device 170 and the buffer layer 140 beforethe subsequent step for forming the pixel electrodes 180 is executed. Inthe present embodiment, besides protecting the active devices 170, thepassivation layer 194 and the buffer layer 140 between the pixelelectrodes 180 and the conductive light-shielding layer 130 are alsoserved as a capacitor dielectric layer of the storage capacitor C1.

After that, a plurality of pixel electrodes 180 is formed above thebuffer layer 140. Each of the pixel electrodes 180 is electricallyconnected to one of the active devices 170, and an overlapping area P1between each of the pixel electrodes 180 and the conductivelight-shielding layer 130 constitutes a storage capacitor C1, as shownin FIG. 3G. In the present embodiment, the pixel electrodes 180 may beformed through a photolithography process. For example, a transparentelectrode material layer (not shown) is formed on the buffer layer 140,wherein the transparent electrode material layer may be formed throughsputtering or evaporation. Then, the transparent electrode materiallayer is patterned through a photolithography process to form the pixelelectrodes 180 within specific areas. However, the technique describedabove for forming the pixel electrodes 180 is only an example but notintended to limit the present invention, and other techniques, such asscreen printing, coating, inkjet printing, and energy source processing,may also be adopted. Herein the pixel structure 100 illustrated in FIG.2 is completed.

In the present embodiment, an alignment pattern T1 is further formed atthe periphery of the substrate 110 when the color filter layer 120 isformed on the substrate 110, as shown in FIG. 3H. The alignment patternT1 is used for alignment in subsequent photolithography process. To bespecific, the conductive light-shielding layer 130 is formed on thesubstrate 110 through following steps. First, a conductive layer (notshown) is deposited on the substrate 110 by using a shadow mask M1,wherein the conductive layer exposes the alignment pattern T1. Then, apatterning process is performed on the conductive layer to form theconductive light-shielding layer 130 as shown in FIG. 3C. It should benoted that by adopting the shadow mask, the alignment pattern isprevented from being covered by the conductive layer or becoming unclearand no alignment problem will be caused in subsequent process.

It should be mentioned that the manufacturing process of a typical colorfilter substrate is completed after the steps in FIGS. 3A-3B or FIGS.3A-3C are completed. In other words, in the present embodiment, anothercolor filter substrate may simply be formed through the manufacturingprocess other than an array on color filter (AOC) structure.

It should be noted that if in the present embodiment, a display panel isformed if an opposite substrate 114 is disposed opposite to thesubstrate 110 and a common electrode 116 is disposed on the oppositesubstrate 114, and a liquid crystal display (LCD) panel is formed if aliquid crystal layer is filled between the opposite substrate 114 andthe substrate 110.

FIG. 4A and FIG. 4B are cross-sectional views respectively illustratingother possible optical structures adopted by the pixel structure in FIG.2. For example, a vertical alignment (VA) mode design is adopted on thepixel structure 100 a to achieve a higher viewing angle when the pixelstructure 100 a is applied to a display panel. Namely, an alignmentpattern layer 196 is further formed in the pixel structure 100 a,wherein the alignment pattern layer 196 is disposed on the commonelectrode 116 of the opposite substrate 114, as shown in FIG. 4A. Inanother embodiment that is not illustrated, the alignment pattern layer196 in FIG. 4A may also be disposed on the pixel electrode 180. In yetanother embodiment that is not illustrated, the alignment pattern layer196 in FIG. 4A may also be disposed on both the pixel electrode 180 andthe common electrode 116 of the opposite substrate 114. However, thepresent invention is not limited thereto, and the disposition of thealignment pattern layer 196 can be determined according to the actualdesign requirement. In addition, even though the alignment pattern layer196 is illustrated as in a triangular shape in FIG. 4A, the presentinvention is not limited thereto, and the alignment pattern layer 196may also be in a circular shape, an elliptic shape, a rectangular shape,a square shape, a strip shape, or other suitable shapes.

Moreover, besides the VA mode design, a fringe field switching (FFS)mode design may also be adopted on the pixel structure 100 b so that anoptimal viewing angle can be achieved when the pixel structure 100 b isapplied to a display panel. In other words, the pixel structure 100 bmay further include an insulation layer 198 a and a common electrodepattern layer 198 b. The insulation layer 198 a covers the pixelelectrode 180, and the common electrode pattern layer 198 b is disposedon the insulation layer 198 a, as shown in FIG. 4B.

In the pixel structures 100, 100 a, and 100 b described above, theactive device 170 is described as a top-gate transistor, and theconductive light-shielding layer 130 is always located below the activedevice 170. In following embodiments, the active device 270 may be abottom-gate transistor as shown in FIG. 5, and the conductivelight-shielding layer 230 may be disposed above the active device 270.

It should be noted that because the function of the common electrodepattern layer 198 b in the pixel structure 100 b is similar to that ofthe common electrode 116 described above, a display panel is formedwithout disposing the common electrode 116 on the opposite substrate 114in the pixel structure 100 b. Similarly, a LCD panel is formed if aliquid crystal layer (not shown) is filled between the oppositesubstrate 114 and the substrate 110.

FIG. 5 is a cross-sectional view of a pixel structure according toanother embodiment of the present invention. Referring to FIG. 5, in thepresent embodiment, the pixel structure 200 includes a substrate 210, acolor filter layer 220, a scan line 250, a data line 260, an activedevice 270, a pixel electrode 280, a buffer layer 240, and a conductivelight-shielding layer 230. The pixel structure 200 is similar to thepixel structure 100, and the difference between the two is that in thepixel structure 200, the active device 270 is described as a bottom-gatetransistor, the conductive light-shielding layer 230 is disposed abovethe active device 270 and the pixel electrode 280, and the buffer layer240 is also disposed above the pixel electrode 280. To be specific, thebuffer layer 240 covers the pixel electrode 280, and the conductivelight-shielding layer 230 is disposed on the buffer layer 240 andcorresponding to the periphery of the pixel region 212, wherein theoverlapping area Pb between the pixel electrode 280 and the conductivelight-shielding layer 230 constitutes a storage capacitor C1.

In other words, besides being served as a black matrix, the conductivelight-shielding layer 230 in the present embodiment can also be servedas a storage capacitor of the pixel structure 200 due to theconductivity thereof and the overlapping area between the conductivelight-shielding layer 230 and the pixel electrode 280. Thus, theconventional design having a common electrode as the storage capacitoris replaced, and the aperture ratio of the pixel structure 200 in thepresent embodiment is improved. In the present embodiment, the activedevice and the conductive light-shielding layer at least partiallyoverlap each other. In the present embodiment, the pixel structure 200may further include a planarization layer 292 for covering the colorfilter layer 220.

As described above, the pixel structure 200 in the present embodimentadopts the same concept as the pixel structure 100 through differentstructure. Thus, the pixel structure 200 has the advantages of the pixelstructure 100 therefore will not be described herein.

FIGS. 6A-6E are cross-sectional views illustrating a manufacturingprocess of the pixel structure in FIG. 5. Because the pixel structure200 is similar to the pixel structure 100, some steps in the procedurefor manufacturing the two are similar too. In other words, the structureillustrated in FIG. 6A can be completed after the steps in FIGS. 3A-3Bare executed. After that, a plurality of scan lines 250, a plurality ofdata lines 260, and a plurality of active devices 270 electricallyconnected to the scan lines 250 and the data lines 260 are formed abovethe color filter layer 220 illustrated in FIG. 6A, as shown in FIG. 6B.In the present embodiment, the technique for forming the scan lines 250,the data lines 260, and the active devices 270 can be referred to thedescription related to FIG. 3E therefore will not be described herein.

Next, before executing the subsequent step for forming the pixelelectrode 280, a passivation layer 294 is selectively formed on theactive device 270 to cover the active device 270, as shown in FIG. 6C.In the present embodiment, the passivation layer 294 is disposed forprotecting the active device 270.

After that, a plurality of pixel electrodes 280 is formed above thecolor filter layer 220, wherein each of the pixel electrodes 280 iselectrically connected to one of the active devices 270, as shown inFIG. 6D. The technique for forming the pixel electrodes 280 in thepresent embodiment is similar to that for forming the pixel electrodes180 and can be referred to foregoing description related to FIG. 3G,therefore will not be described herein.

Next, a buffer layer 240 is formed to cover the active devices 270 andthe pixel electrodes 280, as shown in FIG. 6E. In the presentembodiment, the material of the buffer layer 240 can be referred to thatof the buffer layer 140, and the buffer layer 240 may be formed throughCVD or other suitable techniques, such as screen printing, coating,inkjet printing, and energy source processing.

Thereafter, a conductive light-shielding layer 230 is formed at theperipheries of the pixel regions 212 on the buffer layer 240. Anoverlapping area P1 between each of the pixel electrodes 280 and theconductive light-shielding layer 230 constitutes a storage capacitor C1,as shown in FIG. 5. In the present embodiment, the conductivelight-shielding layer 230 may be formed on the buffer layer 240 throughfollowing steps. First, a conductive layer (not shown) is deposited onthe buffer layer 240 by using a shadow mask (not shown), wherein theconductive layer exposes aforementioned alignment pattern. Then, apatterning process is performed on the conductive layer to form theconductive light-shielding layer 230, as shown in FIG. 5. Herein thepixel structure 200 illustrated in FIG. 5 is completed.

It should be mentioned that the pixel structure 200 may also adopt thedesign as illustrated in FIG. 4A and FIG. 4B to achieve an optimalviewing angle when the pixel structure 200 is applied to a displaypanel.

FIG. 7 is a cross-sectional view of a pixel structure according toanother embodiment of the present invention. Referring to FIG. 7, in thepresent embodiment, the pixel structure 300 includes a substrate 310, acolor filter layer 320, a scan line 350, a data line 360, an activedevice 370, a buffer layer 340, a conductive light-shielding layer 330,a planarization layer 392, and a pixel electrode 380. The pixelstructure 300 is also assumed to be a bottom-gate transistor, as thepixel structure 200 described above. The difference between the twopixel structures is that in the pixel structure 300, the conductivelight-shielding layer 330 is formed on the substrate 310 before thepixel electrode 380. However, in the pixel structure 200, the pixelelectrode 280 is formed on the substrate 210 before the conductivelight-shielding layer 230. In other words, the pixel structure 300 inthe present embodiment may be formed by adjusting the sequence in whichthe conductive light-shielding layer 230 and the pixel electrode 280 areformed in the pixel structure 200. In the present embodiment, theoverlapping area between the pixel electrode 380 and the conductivelight-shielding layer 330 also constitutes a storage capacitor C1. Thus,besides being served as a black matrix, the conductive light-shieldinglayer 330 in the present embodiment can also be served as a storagecapacitor of the pixel structure 300 due to the conductivity thereof andthe overlapping area between the conductive light-shielding layer 330and the pixel electrode 380. Thereby, the conventional design having acommon electrode as the storage capacitor is replaced, and the apertureratio of the pixel structure 300 in the present embodiment is improved.

As described above, the pixel structure 300 in the present embodimentadopts the same concept as the pixel structure 200. However, differentlayers in these two pixel structures are formed in different sequences.Thus, the pixel structure 300 has the advantages of the pixel structure200 therefore will not be described herein.

It should be mentioned that besides being disposed at the periphery ofthe pixel region 312, the conductive light-shielding layer 330 of thepixel structure 300 may also be disposed within the pixel region 312.The overlapping area between the conductive light-shielding layer 330within the pixel region 312 and the pixel electrode 380 also constitutesa storage capacitor C1 such that the storage capacitance of the pixelstructure 300 is further improved. It should be noted that the size ofthe conductive light-shielding layer 330 within the pixel region 312will affect the aperture ratio of the pixel structure 300. Thus, thearea of the conductive light-shielding layer 330 within the pixel region312 should be determined according to the actual design requirement.However, this is only an example to show that the conductivelight-shielding layer 330 may be implemented in other ways but notintended to limit the present invention.

In addition, the pixel structure 300 in the present embodiment mayfurther include a capping layer 410 and a buffer layer 420. The cappinglayer 410 is disposed on the color filter layer 320, and the bufferlayer 420 is disposed on the capping layer 410, as shown in FIG. 7.

Moreover, because the pixel structure 300 is formed by simply adjustingthe sequence in which the conductive light-shielding layer 230 a and thepixel electrode 280 are formed in the pixel structure 200, only thosedifferent steps in the manufacturing method of the pixel structure 300will be described.

After the steps illustrated in FIG. 6B are completed, the buffer layer340 is formed to cover the active devices 370, and the conductivelight-shielding layer 330 is formed at the peripheries of the pixelregions 312 on the buffer layer 340. After that, the planarization layer392 is formed to cover the conductive light-shielding layer 330, and aplurality of pixel electrodes 380 is formed on the planarization layer392 and above the color filter layer 320, wherein each of the pixelelectrodes 380 is electrically connected to one of the active devices370, and an overlapping area between each of the pixel electrodes 380and the conductive light-shielding layer 330 constitutes a storagecapacitor C1. Herein the pixel structure 300 illustrated in FIG. 7 iscompleted, and the techniques and materials for forming the color filterlayer 320, the scan lines 350, the data lines 360, the active devices370, the buffer layer 340, the conductive light-shielding layer 330, theplanarization layer 392, and the pixel electrodes 380 can be referred toforegoing description therefore will not be described herein.

It should be mentioned that the pixel structure 300 may also adopt thedesigns illustrated in FIG. 4A and FIG. 4B to achieve an optimal viewingangle when the pixel structure 300 is applied to a display panel.

In summary, the pixel structure and the method for manufacturing thepixel array provided by the present invention have at least followingadvantages. A conductive light-shielding layer is disposed at theperiphery of a pixel region, and an overlapping area between the pixelelectrode and the conductive light-shielding layer constitutes a storagecapacitor of the pixel structure. Thus, besides being served as a blackmatrix as in the conventional display technique, the conductivelight-shielding layer can also be served as a storage capacitor by beingpartially overlapped with the pixel electrode. In other words, theconventional design having a common electrode as a storage capacitor isreplaced, and the aperture ratio of the pixel structure is improved.

Moreover, if the pixel structure in the present invention still adoptsthe conventional design having a common electrode as a storagecapacitor, since the conductive light-shielding layer and the pixelelectrode form a storage capacitor, the pixel structure in the presentinvention has a greater storage capacitance, and accordingly a betterelectrical performance, compared to a conventional pixel structure.Furthermore, a method for manufacturing the pixel structure and thepixel array is also provided in the present invention.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. A pixel structure, comprising: a substrate,having a pixel region; a color filter layer, disposed above thesubstrate and corresponding to the pixel region; a scan line and a dataline, disposed above the color filter layer; an active device, disposedabove the color filter layer and electrically connected to the scan lineand the data line; a pixel electrode, disposed above the color filterlayer and electrically connected to the active device; a buffer layer,covering the pixel electrode; and a conductive light-shielding layer,disposed above the buffer layer and corresponding to a periphery of thepixel region, wherein an overlapping area between the pixel electrodeand the conductive light-shielding layer constitutes a storagecapacitor.
 2. The pixel structure according to claim 1, wherein theactive device and the conductive light-shielding layer at leastpartially overlap each other.
 3. The pixel structure according to claim1 further comprising a planarization layer covering the color filterlayer.
 4. The pixel structure according to claim 1 further comprising:an insulation layer, covering the pixel electrode; and a commonelectrode pattern layer, disposed on the insulation layer.
 5. A methodfor manufacturing a pixel array, comprising: providing a substrate,wherein the substrate has a plurality of pixel regions; forming a colorfilter layer above the substrate, wherein the color filter layer iscorresponding to the pixel regions; forming a plurality of scan lines, aplurality of data lines, and a plurality of active devices electricallyconnected to the scan lines and the data lines above the color filterlayer; forming a plurality of pixel electrodes above the color filterlayer, wherein each of the pixel electrodes is electrically connected toone of the active devices; forming a buffer layer to cover the activedevices and the pixel electrodes; and forming a conductivelight-shielding layer at peripheries of the pixel regions above thebuffer layer, wherein an overlapping area between each of the pixelelectrodes and the conductive light-shielding layer constitutes astorage capacitor.
 6. The manufacturing method according to claim 5,wherein in the step of forming the color filter layer above thesubstrate, an alignment pattern is further formed at a periphery of thesubstrate.
 7. The manufacturing method according to claim 6, wherein thestep of forming the conductive light-shielding layer above the bufferlayer comprises: depositing a conductive layer above the buffer layer byusing a shadow mask, wherein the conductive layer exposes the alignmentpattern; and performing a patterning process on the conductive layer toform the conductive light-shielding layer.
 8. The manufacturing methodaccording to claim 5 further comprising forming a planarization layer tocover the color filter layer.
 9. The manufacturing method according toclaim 5, wherein after the step of forming the pixel electrodes, themanufacturing method further comprises: forming an insulation layer tocover the pixel electrodes; and forming a common electrode pattern layeron the insulation layer above each of the pixel electrodes.